COMPARE: Models
Mx Model vs Mx Model
MxDW2, MxSW2-hi and MxSW2-lo side views, rendering.
MxDW, MxSW-hi and MxSW-lo side views, rendering.
The second-generation MxDW2 / MxSW2-hi / MxSW2-lo and first-generation MxDW / MxSW-hi / MxSW-lo models have minor differences as they all share the same massive heatsink, all are available with fans to boost cooling, and all include exchangeable supports. So select the Mx model that best meets your current workstation setup and aesthetic preferences, and add additional supports with bundle discounts as needed. If preferences for workstation setups and aesthetics are less of a factor, then the following comparisons may aide in Mx model selection.Mx 2nd vs 1st Gen Supports
2nd Gen Support Advantages
- MxDW2 / MxSW2-hi / MxSW2-lo enlarges support openings and raises heatsink position for improved heatsink and fan airflow cooling.
- MxSW2-hi / MxSW2-lo lowers heatsink angle for improved conductive coupling and heat transfer cooling.
- MxSW2-hi / MxSW2-lo includes new laptop support arms for improved laptop fit and cooling, especially for smaller 14-inch and 13-inch laptops.
- MxSW2-hi / MxSW2-lo reduces desktop footprint to free up desk space and create a more compact workstation setup.
- MxSW2-hi / MxSW2-lo includes new area for tucking in external keyboard.
- MxSW2-hi includes new adjustable height supports and MxSW2-lo includes new adjustable height feet for leveling uneven surfaces.
- MxDW2 / MxSW2-hi / MxSW2-lo includes new white hardwood support material made from 9 layers of high-quality baltic birch hardwood veneers to create a solid void-free multi-ply core with formaldehyde-free binder.
- MxDW2 / MxSW2-hi / MxSW2-lo includes new black heatsink finish for improved emissivity and radiant cooling.
- MxSW2-hi includes components to reconfigure into the MxSW2-lo low stand for no extra cost.
- MxSW-hi / MxSW-lo includes multiple heatsink positions for compatibility with a wide range of laptop sizes in a single support part.
Mx Stand vs Dock Supports
Stand Support Advantages
- MxSW2-hi high stand includes components to reconfigure into the MxSW2-lo low stand for no extra cost.
- Flexibility of operating laptop with the screen-closed in clamshell mode or with the screen open for use of the laptop’s built-in display and keyboard/trackpad.
- Accommodates a wide variety of laptop models and sizes with separate bolt-on laptop support arms (2nd gen) or adjustable heatsink mounting positions (1st gen).
- Near horizontal laptop support position presses laptop weight onto the heatsink for increased conductive heat transfer (2nd gen further improved).
- Frees up desk space with a leaning upright laptop position for a more compact reduced desk footprint (2nd gen high/low stands have reduced footprint, along with recessed area for tucking in keyboard).
- Accommodates a wide variety of laptop models a sizes with unique patented leaning clamshell support system.
- 140mm or 80mm fan compatibility, and can simultaneous run both 140mm and 80mm fans for increased cooling performance.
Mx High vs Low Stand Supports
High Support Advantages
- MxSW2-hi high stand includes components to reconfigure into the MxSW2-lo low stand for no extra cost.
- Elevated laptop position for improved viewing ergonomics and improved alignment with external monitors.
- More open space under heatsink improves passive and active cooling airflows (2nd gen high stand further improved).
- 140mm fan compatibility for increased heatsink cooling with lower noise from an extra-large fan size (2nd gen high stand further improved).
- Lower laptop angle and lower height for a lower profile workstation setup with improved laptop keyboard typing ergonomics (2nd gen high stand also has a lower angle, and is comparable to the angle of 1st gen low stand).
- Lower laptop angle presses laptop weight onto the heatsink for increased conductive heat transfer (2nd gen high stand also has a lower angle, and is comparable to the angle of 1st gen low stand).
- 80mm fan compatibility for heatsink cooling as well as direct internal processor cooling with 2021+ MacBook Pros and other laptops with a central intake vent.
Mx Docks vs DHCR4
DHCR4 on left and MxDW2 on right, side and back views, rendering.
The MxDW2 / MxDW Cooling Dock models pair the Mx heatsink with dock side supports to take the 4th generation DHCR’s exceptional silent thermally conductive heatsink cooling to the next level.- 202% increase in thermally conductive coupling area to silently extract more heat from the laptop processor location when compared to the DHCR 4th gen (219% increase over 1st, 2nd, 3rd gen DHCRs).
- 365% increase in cooling fin surface area to silently remove more heat from the heatsink and to provide more cooling when compared to the DHCR 4th and 3rd gen (579% increase over 1st, 2nd gen DHCRs).
- New enormous 140mm fan bolts directly onto heatsink to boost heatsink cooling performance with maximum cooling and minimum noise.
- New 140mm fan combines with the 80mm fan’s direct internal processor cooling for even greater cooling capabilities.
- New steeper leaning laptop support angle for increased stability and heatsink coupling efficiency.
- New modular laptop support system for multiple workstation setups with the massive heatsink.
- New wood supports for natural aesthetic, lower cost, and increased sustainability with rapidly-renewable bamboo and black-core fiber made from 89% renewable and 100% recovered wood fiber.
- New cable management system hides cable clutter and holds cables in place for quick laptop setup.
- New modular sustainable packaging system made of cardboard and paper-based materials for easy recycling and reduced environmental impact.
Mx Stands vs Sx
SxG12 side and back views, rendering.
MxSW2-hi w/ 140mm fan side and back views, rendering.
MxSW2-lo w/ 80mm fan side and back views, rendering.
The MxSW2-hi / MxSW-hi / MxSW2-lo / MxSW-lo / MxS-lo Cooling Stand models pair the Mx heatsink with high / low stand supports to bring silent thermally conductive heatsink cooling to the Cooling Stand product line for the first time.- Radicle increase in silent cooling capabilities for open-screen and closed-screen laptops.
- Option for even larger and quieter 140mm cooling fan.
- New modular laptop support system for multiple workstation setups with the massive heatsink.
- New second generation supports reduce desktop footprint to free up desk space and create a more compact workstation setup.
- New second generation supports create recessed open space under laptop support arms for users to tuck in an external keyboard.
- New adjustable height supports level uneven surfaces for rock solid laptop support.
- New wood supports for natural aesthetic, lower cost, and increased sustainability with rapidly-renewable bamboo and black-core fiber made from 89% renewable and 100% recovered wood fiber.
- New modular sustainable packaging system made of cardboard and paper-based materials for easy recycling and reduced environmental impact.
- MxSW2-hi high stand includes components to reconfigure into the MxSW2-lo low stand for no extra cost.
OTHER MODELS
DHCR4 vs DHCR1-3
Compare DHCR 4th vs 3rd-1st Gen
The new 4th generation DHCR Cooling Dock includes extensive improvements for a substantial increase in cooling efficiency with the latest Apple MacBook Pro and Air laptops, along with comprehensive optimization for the 2021+ MacBook Pro. The 4th gen’s thermally conductive heatsink silently reduces overall laptop temperatures, while the Fx Cooling Fan boosts peak performance potential for sustained heavy workloads.
The new and improved 4th gen DHCR cooling features are grouped into the following three categories as shown in the diagram above and described below: (1) conductive cooling, (2) heatsink cooling and (3) airflow cooling.
(1) Conductive Cooling
The 4th gen DHCR improves conductive cooling with increased heat transfer from flat-backed laptops like the 2021+ MacBook Pro and 2022+ MacBook Air. This is accomplished with a larger thermally conductive interface for increased surface area, a thinner laptop coupling plate for increased heat distribution, and available for the time time with the 4th gen, direct metal-to-metal laptop coupling for reduced impedance and unrestricted conductive heat transfer.
| DHCR Model Generation | 4th | 3rd | 2nd | 1st |
| conductive coupling surface area (sq.in.) | 13.3 | 12.6 | 12.6 | 12.6 |
| 4th gen percentage improvement | 6% | 6% | 6% | |
| conductive coupling plate thickness (in.) | 0.467 | 0.522 | 1.462 | 1.462 |
| 4th gen percentage improvement | 11% | 68% | 68% | |
| conductive material thickness (in.) | 0.0000 | 0.0099 | 0.0128 | 0.0128 |
| 4th gen percentage improvement | 100+% | 100+% | 100+% |
(2) Heatsink Cooling
The 4th gen DHCR improves heatsink cooling with increased heat transfer from heatsink to passive/active cooling airflows. This is accomplished with deeper and taller cooling fin air channels, increased surface area, and more continuous and interconnected cooling fin air channels for increased heat flow throughout the heatsink.
(2a) Deeper and taller cooling fins and air channels increase surface area.
| DHCR Model Generation | 4th | 3rd | 2nd | 1st |
| cooling fin / air channel depth (in.) | 2.618 | 1.954 | 0.920 | 0.920 |
| 4th gen percentage improvement | 34% | 185% | 185% | |
| cooling fin / air channel height (in.) | 3.852 | 3.255 | 3.255 | 3.255 |
| 4th gen percentage improvement | 18% | 18% | 18% | |
| cooling surface area (sq.in.) | 188 | 163 | 124 | 124 |
| 4th gen percentage improvement | 15% | 52% | 52% |
(2b) Continuous and interconnected cooling fins and air channels carved into a solid block of aluminum increase heat flow throughout the heatsink.
| DHCR Model Generation | 4th | 3rd | 2nd | 1st |
| side-to-side interconnection (in.) | 2.980 | 0.315 | 0.315 | 0.315 |
| 4th gen percentage improvement | 846% | 846% | 846% | |
| front-to-back interconnection (in.) | 2.260 | 0.376 | 0.376 | 0.376 |
| 4th gen percentage improvement | 501% | 501% | 501% | |
| top-to-bottom interconnection (in.) | 4.809 | 1.809 | 1.809 | 1.809 |
| 4th gen percentage improvement | 166% | 166% | 166% |
(3) Airflow Cooling
The 4th gen DHCR improves airflow cooling with increased airflow into the 2021+ MacBook Pro’s center air intake vent for direct internal processor cooling, as well as flushing out more hot air away from laptop exhaust vents. This is accomplished with more through-hole openings, an increase in total through-hole open area, and an increase in opening width. Available for the first time with the 4th gen, the through-holes become air channels that extend below the laptop’s bottom edge with a position and angle to guide cooling airflow into the 2021+ MacBook Pro’s center intake. A smaller front horizontal air channel with deeper curving sides concentrates cooling airflow along the laptop’s bottom edge vents.
(3a) More numerous through-hole open area spread over a wider area to increase cooling airflow.
| DHCR Model Generation | 4th | 3rd | 2nd | 1st |
| side-to-side thru-hole length (in.) | 2.798 | 1.115 | 1.115 | 1.115 |
| 4th gen percentage improvement | 151% | 151% | 151% | |
| thru-hole open area (sq.in.) | 1.05 | 0.55 | 0.55 | 0.55 |
| 4th gen percentage improvement | 91% | 91% | 91% | |
| number of thru-holes | 7 | 1 | 1 | 1 |
| 4th gen percentage improvement | 7x | 7x | 7x |
(3b) Smaller front horizontal air channel with deeper curving sides to concentrate cooling airflow along the laptop’s bottom edge.
| DHCR Model Generation | 4th | 3rd | 2nd | 1st |
| front air channel radius (in.) | 0.625 | 0.750 | 0.750 | 0.750 |
| 4th gen percentage improvement | 22% | 22% | 22% | |
| curving side depth (in.) | 1.127 | 0.625 | 0.625 | 0.000 |
| 4th gen percentage improvement | 80% | 80% | 100+% |
(3c)New numerous through-hole air channels that extend below the laptop’s bottom edge with a position and angle to guide cooling airflow into the 2021+ MacBook Pro’s center intake. This is an entirely new feature that was not included in prior generations.
(3d)Three new heatsink performance pads help to manage airflows for improved cooling performance. New performance bottom pads feature 1/8” thickness to create a large underside open air channel for improved heatsink cooling. New performance laptop support pad features 1/8” thickness with a center cutout matching the heatsink’s through-holes for improved cooling airflow into a 2021+ MacBook Pro’s central air intake vent, and features side extensions into the horizontal channel’s curving ends. Both of the new 1/8” thick performance pads are designed to work in conjunction with the new performance insulating side pads that protect the heatsink from a 2021+ MacBook Pro’s hot air exhaust vents.
The above section cuts show the DHCR’s generational changes.
DHCR vs DHC
Compare DHCR vs DHC
Design
- DHCR: Rectilinear styling with a solid heatsink carved with a smaller diameter end mill to create more air channels and more cooling fins within a given volume, which increases cooling surface area along with increasing costs. The DHCR’s new 4th generation design further elevates heatsink conductive cooling, heatsink passive airflow cooling and active airflow cooling.
- DHC: Angular styling with a solid heatsink carved with a larger diameter end mill to create wider air channels, which increases cooling airflows.
- DHCR: #1 overall performance ranking with optional Fx Cooling Fan.
- DHC: #2 overall performance ranking with optional Fx Cooling Fan.
- DHCR: Optimized for the current generation of flat backed Apple laptops, such as the 2021+ MacBook Pro and 2022+ MacBook Air, but works with other current and prior gen Apple laptops, as well as many metal PC laptops. Optimization for the 2021+ MacBook Pro include features such as the following: Extra-large thermally conductive laptop coupling plate to extra more heat from the flat-backed laptop. The heatsink’s numerous vertical cooling fin air channels extending through the heatsink mass to become thru-holes that guide cooling airflow into a horizontal air channel with curving ends to flush out hot exhaust air from the laptop. The front horizontal channel uses a smaller size to concentrate airflow along the laptop’s bottom screen-hinge edge, while numerous thru-hole air channels extend below the laptop’s center intake vent, with the ends of the air channels angle up to guide cooling airflow into the laptop vent.
- DHC: Optimized for more universal compatibility with current and prior gen Apple laptops, as well as many metal PC laptops.
- DHCR: 13.3 square inches of thermally conductive area for extracting more heat from flat backed laptops. Refined heatsink coupling plate allows for direct metal-to-metal laptop coupling and unrestricted heat transfer.
- DHC: 8.9 square inches of thermally conductive area for fitting with laptops that have a more round or curving edge, as well as a wider variety of laptops.
- DHCR: 12 narrow cooing fins and 11 narrow vertical air channels for increased heat flow and cooling surface area, while providing high-volume of pass-through airflow.
- DHC: 6 wide cooing fins and 5 wide vertical air channels for increased cooling airflow.
- DHCR: 143 square inches of cooling fin surface area for increased heat transfer to passive and active airflow. The cooling fin air channels extremely deep into the heatsink and extend all of the way through to become through holes along the front horizontal air channel.
- DHC: 72 square inches of cooling fin surface area.
- DHCR: 2.6 pound heatsink carved from solid aluminum for increased thermal capacity and improved heat movement through thermal mass. The cooling fins run continuously from top-to-bottom and front-to-back for improved heat flow within the heatsink mass.
- DHC: 2.3 pound heatsink carved from solid aluminum for improved heat movement through thermal mass.
DHCR vs DHCx
Compare DHCR vs DHCx
Design
- DHCR: The DHCR uses rectilinear styling with a solid heatsink carved with a smaller diameter end mill to create more air channels and more cooling fins within a given volume, which increases cooling surface area along with increasing costs. The DHCR’s new 4th generation design further elevates heatsink conductive cooling, heatsink passive airflow cooling and fan driven active airflow cooling. The DHCR has been designed to work with a separate Fx Cooling Fan. Separating the cooling fan from the heatsink avoids having to remove thermal mass and cooling surface area to make room for a built-in fan, which provides the DHCR heatsink with higher cooling capacity. The separated fan also allows the fan to be located within unrestricted open air for increased airflow and decreased noise.
- DHCx: The DHCx design is based on the 3rd generation DHC model with angular styling with a solid heatsink carved with a larger diameter end mill to create wider air channels, which increases cooling airflows. The DHCx model offers a single item configuration with a smaller product footprint and the convenience of a built-in fan for users that want active airflow cooling.
- DHCR: #1 overall performance ranking with optional Fx Cooling Fan.
- DHCx: #3 overall performance ranking compared to the DHCR with Fx Cooling Fan, and offers similar cooling to the DHCR when used without the Fx.
- DHCR: Optimized for the current generation of flat backed Apple laptops, such as the 2021+ MacBook Pro and 2022+ MacBook Air, but works with other current and prior gen Apple laptops, as well as many metal PC laptops. Optimization for the 2021+ MacBook Pro include features such as the following: Extra-large thermally conductive laptop coupling plate to extra more heat from the flat-backed laptop. The heatsink’s numerous vertical cooling fin air channels extending through the heatsink mass to become thru-holes that guide cooling airflow into a horizontal air channel with curving ends to flush out hot exhaust air from the laptop. The front horizontal channel uses a smaller size to concentrate airflow along the laptop’s bottom screen-hinge edge, while numerous thru-hole air channels extend below the laptop’s center intake vent, with the ends of the air channels angle up to guide cooling airflow into the laptop vent.
- DHCx: Optimized for more universal compatibility with current and prior gen Apple laptops, as well as many metal PC laptops.
- DHCR: 13.3 square inches of thermally conductive area for extracting more heat from flat backed laptops. Refined heatsink coupling plate allows for direct metal-to-metal laptop coupling with unrestricted heat transfer.
- DHCx: 8.9 square inches of thermally conductive area for fitting with laptops that have a more round or curving edge, as well as a wider variety of laptops.
- DHCR: 12 narrow cooing fins and 11 narrow vertical air channels for increased heat flow and cooling surface area, while providing high-volume of pass-through airflow.
- DHCx: 5 wide cooing fins and 4 wide vertical air channels for increased cooling airflow.
- DHCR: 143 square inches of cooling fin surface area for increased heat transfer to passive and active airflow. The cooling fin air channels extremely deep into the heatsink and extend all of the way through to become through holes along the front horizontal air channel.
- DHCx: 27 square inches of cooling fin surface area.
- DHCR: 2.6 pound heatsink carved from solid aluminum for increased thermal capacity and improved heat movement through thermal mass. The cooling fins run continuously from top-to-bottom and front-to-back for improved heat flow within the heatsink mass.
- DHCx: 2.0 pound heatsink carved from solid aluminum for improved heat movement through thermal mass.
DHC vs DHCx
Compare DHC vs DHCx
Design
- DHC: The DHCR and DHC designs prioritize maximum heatsink performance for both silent passive airflow and fan driven active airflow. Separating the cooling fan from the heatsink avoids having to remove thermal mass and cooling surface area to make room for a built-in fan, which provides the DHCR and DHC heatsinks with higher cooling capacity. The separated fan also allows the fan to be located within unrestricted open air for increased airflow and decreased noise.
- DHCx: The DHCx offers a single item configuration with a smaller product footprint and the convenience of a built-in fan for users that want active airflow cooling.
- DHC: #2 overall performance ranking with optional Fx Cooling Fan, so slightly better than the DHCx.
- DHCx: #3 overall performance ranking compared to the DHC with Fx, but out performs the DHC without the Fx.
- DHC: 6 wide cooing fins and 5 wide vertical air channels for increased cooling airflow for increased cooling surface area.
- DHCx: 5 wide cooing fins and 4 wide vertical air channels for increased cooling airflow.
- DHC: 72 square inches of cooling fin surface area for increased heat transfer to passive and active airflow.
- DHCx: 27 square inches of cooling fin surface area.
- DHC: 2.3 pound heatsink carved from solid aluminum for increased thermal capacity and improved heat movement through thermal mass.
- DHCx: 2.0 pound heatsink carved from solid aluminum for improved heat movement through thermal mass.
DHCx vs Dx
Compare DHCx vs Dx
Design
- DHCx: The DHCx design uses thermally conductive coupling with the laptop and a solid aluminum heatsink carved with cooling fin air channels to extract heat from the laptop, as well as directing active airflow for flushing out hot air, cooling the laptop enclosure surface, and internally cooling processors on laptops that include a center intake vent.
- Dx: The Dx design uses active airflow for cooling the bottom surface of the laptop enclosure, as well as internally cooling processors on laptops that include a center intake vent.
- DHCx: 9 square inches of thermally conductive area for fitting with laptops that have a more round or curving edge, as well as a wider variety of laptops.
- Dx: No thermally conductive coupling occurs as airflow cooling of the laptop enclosure surface is used instead of conductive heatsink cooling, however, some radiant heat transfers to the solid aluminum dock.
- DHCx: 5 wide cooing fins and 4 wide vertical air channels for increased cooling airflow.
- Dx: No cooling fins are included as airflow cooling of the laptop enclosure surface is used instead of conductive heatsink cooling.
- DHCx: 27 square inches of cooling fin surface area.
- Dx: 6 square inches of cooling surface area with the interior air chamber and ten vent slots.
- DHCx: 2.0 pound heatsink carved from solid aluminum for improved heat movement through thermal mass.
- Dx: 1.8 pound carved solid aluminum.
- DHCx: Fully modular right-to-repair system that uses bolted and snapped connections that work with virtually any available 80mm fan, any fan screen/guard system and any fan speed/power control system, plus allows for quick fan removal for cleaning, servicing or replacement.
- Dx: Modular right-to-repair system that uses bolted and snapped connections that work with most available 80mm fans.
SRx vs Sx
Compare SRx vs Sx
Design
- SRx: Rectilinear styling with a multi-component base support made from an anodized aluminum flat front mounting plate and separate steel support legs.
- Sx: Angular styling with a single component base support made from formed anodized aluminum.
- SRx: The two upper support arms and two lower support legs have slightly oversized mounting holes to allow for small height adjustments, and the product ships with one set of levels pads for additional small height adjustments to both the upper arms and lower legs.
- Sx: The two upper support arms have slightly oversized mounting holes to allow for small height adjustments, and the product ships with one set of upper arm levels pads for additional small height adjustments. The solid aluminum support base has four threaded holes at the four corners of the lower horizontal panel. The product ships with four leveling fasteners with non-slip pads that can be installed fully recessed within the aluminum base’s thickness and then each can be independently deployed to level the base for small to larger height adjustments as required. The base’s threaded holes can also be used to bolt the Stand to a desk or mobile workstation.
- SRx: Cables can be fed through the gap under the anodized aluminum front mounting plate, as well as the sides through the gap under the support legs. The cables are then hidden from view and routed to the laptop along the inside of the upper support arms.
- Sx: Cables can be fed from the sides, then hidden from view and routed to the laptop along the inside of the upper support arms.
- SRx: The flat anodized aluminum mounting plate with separate support legs allows the individual components to fit within more compact and slimmer product packaging with locking lid for easier transportation.
- Sx: The heavier and larger solid anodized aluminum support base ships with the cooling system pre-installed and with the base bolted onto the product packaging. This allows the inner product packaging to also act as the outer shipping packaging, which reduces shipment size and shipping waste.
COMPARE: Features
SHARED FEATURES
All SVALT products are unique first-and-only products of their kind with innovated designs and features, as well as numerous issued and pending patents. Made locally in the Pacific Northwest in small hand built batches with a focus on sustainability and enduring metal and wood construction, all SVALT products use modular bolted/snapped cooling system assemblies and ship with the tools required for right-to-repair servicing, exchanging and upgrading.
All SVALT Cooling Dock models work with the laptop operating in closed-screen clamshell mode. Docks feature a unique and stable leaning configuration for easy clamshell setup while the laptop remains connected to cables and safely held on a non-slip padded laptop shelf. Docks can drive cooling air into intake vents to directly cool processors on compatible laptops.
All SVALT Cooling Stand models work with the laptop screen open for a more visually ergonomic workstation, either with the user typing directly on the rigid no-bounce stand or while using an external keyboard and display.
Mx FEATURES
MxSW2-hi / MxSW-hi
Cooling Stand from $389
MxSW2-lo / MxSW-lo / MxS-lo
Cooling Stand from $379
MxDW2 / MxDW
Cooling Dock from $379
Silent Conductive Heatsink Cooling for Closed and Open-Screen Laptops
The Mx modular system is built around a massive 4 pound thermally conductive heatsink carved from solid aluminum with an extensive array of ultra-thin cooling fins for extreme levels of silent cooling. The Mx heatsink has also been designed for radical active airflow cooling capabilities from a variety of high-quality and ultra-quiet fan systems, including enormous 140mm Noctua fans.
Mx side supports bolt onto the heatsink to create three models types with a variety of support designs, materials, colors, and finishes. The high stand supports (MxSW2-hi / MxSW-hi / MxS-hi) for elevated open-screen operation. The low stand supports (MxSW2-lo / MxSW-lo / MxS-lo) for low-profile open-screen operation. The dock supports (MxDW2 / MxDW / MxD) for closed-screen clamshell operation.
The Mx product line uses responsive design to fully integrate every element for optimal fit, function, and cooling performance with Apple’s latest MacBook Pro and MacBook Air laptops, as well as compatibility with all recent Apple laptops, many PC laptops, and other devices.
Mx products include an extensive set of innovative workstation features, such as dual cable straps for quicker laptop setup and hidden cable clutter, as well as heavy-duty construction, over-sized bolted connections, and uneven surface leveling to create a robust build with rock-solid no-bounce stability.
The Mx offers a remarkable degree of modular system flexibility with hundreds of different configurations to help create a customer’s ideal workstation setup. An extensive selection of regularly released and updated Mx modular components allows existing Mx customers reconfigure their workstation setup as needed.
The Mx product line was designed to endure with high-quality materials, high-end components, heavy-duty construction, bolt & snap assemblies, and right-to-repair tools included to extend product service life and customer value. For end-of-life recyclability and biodegradability, the Mx uses metal & wood product construction and paper-based packaging, both with minimal to no use of plastics.
OTHER MODELS
DHCR
DHCR Cooling Dock from $289 for 4th gen SOLD OUT
Silent Conductive Heatsink Cooling for Closed-Screen Laptops
The new 4th generation DHCR offers the ultimate in silent heatsink cooling performance tailored to Apple’s latest flat backed laptops (2021+ MacBook Pros and 2022+ MacBook Airs), as well as working with current and prior generation Apple laptops. The new 4th gen design includes extensive improvements for increased cooling efficiency and peak performance potential. The 4th gen features rectilinear styling, an extra-large thermally conductive interface to more effectively extract heat from the laptop and transfer it to a massive 2.6 pound heatsink carved from solid aluminum with 11 extra-deep cooling fin air channels that create an exceptionally large 143 square inches of cooling fin surface area for improved heatsink cooling. When used with an optional Fx Cooling Fan, the heatsink’s angled air channels and numerous cooling thru-holes boost heatsink cooling performance, as well as drive cooling airflow into 2021+ MacBook Pro center intake vents for direct internal processor cooling. By designing the heatsink to work with a separate fan, the Fx Cooling Fan moves more air with less noise, while allowing for maximum heatsink cooling capacity.
DHC (sold out)
DHC Cooling Dock from $219 for 3rd gen SOLD OUT
Silent Conductive Heatsink Cooling for Closed-Screen Laptops
The 3rd generation DHC offers silent heatsink cooling performance for current and prior generation Apple laptops. The DHC features a thin thermally conductive interface to more effectively extract heat from the laptop and transfer it to a 2.3 pound heatsink carved from solid aluminum with 5 deep cooling fin air channels to create 72 square inches of cooling fin surface area for improved heatsink cooling. When used with an optional Fx Cooling Fan, the heatsink’s angled air channels and numerous cooling thru-holes boost heatsink cooling performance, as well as drive cooling airflow into 2021+ MacBook Pro center intake vents for direct internal processor cooling. By designing the heatsink to work with a separate fan, the Fx Cooling Fan moves more air with less noise, while allowing for maximum heatsink cooling capacity.
DH (sold out)
DH Cooling Dock from $169 for 2nd gen SOLD OUT
Silent Passive Heatsink Cooling for Closed-Screen Laptops
The 2nd generation DH offers stylish silent passive heatsink cooling optimized for a wide range of laptops, and features a massive 3.2 lbs heatsink sculpted from solid aluminum with extra large air channels for passive and active airflow cooling.
DHCx (sold out)
DHCx Cooling Dock from $269 w/ built-in fan SOLD OUT
Quiet Active Airflow and Conductive Heatsink Cooling for Closed-Screen Laptops
The DHCx offers the convenience of a built-in modular fan with thermally conductive heatsink cooling performance for current and prior generation Apple laptops. The DHCx features a thin thermally conductive interface to extract heat from the laptop and transfer it to a 2.0 pound heatsink carved from solid aluminum with 4 deep cooling fin air channels through which an integrated fan drives quiet cooling airflow. This active airflow boosts heatsink cooling performance, flushes out hot air, and internally cools processors on laptops that include a center intake vent (2021+ MacBook Pros, 2012-2015 MacBook Pros and 2010-2017 MacBook Airs).
Dx (sold out)
Dx Cooling Dock from $149 to $199 w/ built-in fan SOLD OUT
Quiet Active Airflow Cooling for Closed-Screen Laptops
The Dx offers more affordable built-in fan cooling performance for current and prior generation Apple laptops. The Dx features quiet laptop surface cooling, as well as direct internal laptop processor cooling on compatible laptops (2021+ MacBook Pros, 2012-2015 MacBook Pros and 2010-2017 MacBook Airs), and offers the convenience of an integrated fan.
DLx (sold out)
DLx Cooling Dock from $209 w/ built-in fan SOLD OUT
Internal Active Airflow Cooling for Closed-Screen Laptops
The DLx offers direct internal laptop processor cooling on a limited number of compatible laptops (2012-2015 MacBook Pros and 2010-2017 MacBook Airs), and features an integrated modular fan cooling system.
SxN (sold out)
SxN Cooling Stand from $179 SOLD OUT
Silent Passive Airflow Cooling for Open-Screen Laptops
The SRxN offers an unmatched level of open airflow for silent passive cooling.
Sx
Sx Cooling Stand from $279
Quiet Active Airflow Cooling for Open-Screen Laptops
The Sx offers an unmatched level of open airflow for lower noise and higher cooling efficiency optimized for a wide range of laptops, and features an extra large and powerful modular dual-speed fan cooling system with new ultra-quiet Noctua fans.
SxM
SxM Cooling Stand from $279
Internal Active Airflow Cooling for Mac Mini
The SxM offers Mac Mini active internal airflow cooling, and features an extra large and powerful modular dual-speed fan cooling system with new ultra-quiet Noctua fans.
SRxN (sold out)
SRxN Cooling Stand from $199 SOLD OUT
Silent Passive Airflow Cooling for Open-Screen Laptops
The SRxN offers rectilinear styling with an unmatched level of open airflow for silent passive cooling.
SRx (sold out)
SRx Cooling Stand from $299 SOLD OUT
Quiet Active Airflow Cooling for Open-Screen Laptops
The SRx offers rectilinear styling with an unmatched level of open airflow for lower noise and higher cooling efficiency optimized for a wide range of Apple and PC laptops, and features an extra large and powerful modular dual-speed fan cooling system with new ultra-quiet Noctua fans.
SRxM (sold out)
SRxM Cooling Stand from $279 SOLD OUT
Internal Active Airflow Cooling for Mac Mini
The SRxM offers rectilinear styling with Mac Mini active internal airflow cooling, and features an extra large and powerful modular dual-speed fan cooling system with new ultra-quiet Noctua fans.
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Cooling Stand MxSW2-hi
Regular price From $399.00 USDRegular price$309.00 USDSale price From $399.00 USD -
Cooling Stand MxSW-hi
Regular price From $389.00 USDRegular price$309.00 USDSale price From $389.00 USD -
Cooling Stand MxSW2-lo
Regular price From $379.00 USDRegular price$309.00 USDSale price From $379.00 USD -
Cooling Stand MxSW-lo
Regular price From $379.00 USDRegular price$289.00 USDSale price From $379.00 USD -
Cooling Stand MxS-lo
Regular price From $429.00 USDRegular price$399.00 USDSale price From $429.00 USD -
Cooling Dock MxDW2
Regular price From $389.00 USDRegular price$299.00 USDSale price From $389.00 USD -
Cooling Dock DHCR
Regular price From $289.00 USDRegular price$279.00 USDSale price From $289.00 USD -
Cooling Stand Sx
Regular price From $279.00 USDRegular price
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