MxW Features: Cooling

SILENT HEATSINK COOLING

MxDW, MxSW-hi and MxSW-lo back view, rendering.

The Mx modular system is built around an enormous thermally conductive heatsink dedicated to extreme silent cooling capabilities. The Mx heatsink is so massive that it has up to 579% more cooling fin surface area than prior generations of the DHCR Cooling Docks.

Mx heatsink top view, rendering.

The entire top surface of the oversized 6.8 inch long x 6.0 inch wide x 1.9 inch deep heatsink provides unrestricted conductive heat transfer at the laptop processor location for more efficient heat extraction. The heatsink’s coupling plate is specially prepared with a fine hand sanded and polished finish to produce an extra-flat and extra-smooth surface for improved conductive heat transfer. The coupling plate edges and corners have been rounded for laptop setup. The coupling plate’s refined design, manufacturing and finishing allows the Mx heatsink to avoid the use of a “protective film coupling” configuration that significantly reduced cooling on prior heatsink models.

Mx heatsink bottom view, rendering.

The heat extracted from the laptop flows efficiently through the heatsink’s 4 pounds of thermal mass milled from a solid block of 6061 aerospace grade aluminum material. The heat flows into an extensive array of 28 cooling fins that are an incredibly 0.080 inches thin for accelerated heat removal through the heatsink’s incredible 709 square inches of overall surface area.

Mx heatsink w/ passive airflow back view, rendering.

The cooling fins and cooling air channels run continuously from front-to-back with an upward angle to generate passive cooling air currents through the entire heatsink. Open space under the heatsink supplies cool air for more effective silent passive cooling, as well as open space for fan driven active airflows.

MxSW-hi bottom view, rendering.

The heatsink’s side support mounting points use 0.125 inch extra-thick pads to create an air gap between the heatsink and side supports. This air gap allows for open cooling airflow around the sides of the heatsink. The air gap and extra-thick pads work together to provide thermal separation between the heatsink, side supports, and exposure to hot exhaust air.

ACTIVE AIRFLOW FAN COOLING

MxDW w/ 140mm fan, MxSW-hi w/ 140mm fan and MxSW-lo w/ Fx 80mm fan back view, rendering.

The Mx product line has been designed for extreme levels of silent thermally conductive heatsink cooling, as well as the option for multiple fan cooling system configurations. The fan driven active airflow boosts the already remarkable levels of silent heatsink cooling. In addition to boosting heatsink cooling, the fan driven active airflows also flush out hot air from around the heatsink and laptop to help maintain ideal cooling conditions.

MxDW and MxSW-hi w/ 140mm fan back views, rendering.

When the Mx heatsink is paired with the dock supports or the high stand supports, then an enormous 140mm fan can be bolted directly onto the heatsink to boost heatsink cooling performance. The heatsink and side support designs have been optimized for increased cooling airflow and reduced noise with the extra-large 140mm fan size.

MxDW and MxSW-lo w/ Fx 80mm fan back views, rendering.

When the Mx heatsink is paired with the dock supports or the low stand supports, then a separate Fx Cooling Fan accessory with 80mm fan is available to boost heatsink cooling performance, as well as provide direct processor cooling through a laptop’s center intake vent, such as with the 2021+ MacBook Pro.

Fx 80mm fan and 140mm fan w/ heatsink exploded view, rendering.

Both the 140mm and 80mm fan cooling systems offer unmatched levels of modularity and right-to-repairability for fan and electrical component installation, upgrades and servicing. The heatsink includes 8-32 threaded holes for standard 140mm fans, and the Fx for standard 80mm fans. Each fan system is available with high-end and long-life Noctua fans, and either fixed or variable speeds. Each system uses an external outlet power supply for optimal fan operation that avoids pulling power from the laptop system that would increase internal laptop temperatures and contribute to processor power throttling.

See Fan Specs and Testing Specs below, as well as Performance page to learn more.