MxSW2-hi 1 heatsink features

HEATSINK COOLING FEATURES

Silent Heatsink Cooling
The Mx modular system is built around a massive thermally conductive heatsink carved from solid aluminum with an extensive array of ultra-thin cooling fins for extreme levels of silent cooling.



Heatsink Mass
The Mx modular system is built around a massive thermally conductive heatsink dedicated to extreme silent cooling capabilities. The heatsink is 6.8 inch long x 6.0 inch wide x 1.9 inch deep and weighs 4 pounds. The heatsink is so massive that it increases the MacBook Pro’s bottom surface area by up to 639% and MacBook Air’s bottom surface area by up to 679% to help silently unlock peak performance potential.



Heatsink Coupling
The entire top surface of the massive heatsink provides unrestricted conductive heat transfer at the laptop processor location for more efficient heat extraction. The heatsink’s coupling plate is specially prepared with a fine hand sanded and polished finish to produce an extra-flat and extra-smooth surface for improved conductive heat transfer. The coupling plate edges and corners have been rounded for laptop setup. The coupling plate’s refined design, manufacturing and finishing allows the Mx heatsink to avoid the use of a “protective film coupling” configuration that significantly reduced cooling on prior heatsink models.



Heatsink Heat Flow
The heat extracted from the laptop flows efficiently through the heatsink’s 4 pounds of thermal mass milled from a solid block of 6061 aerospace grade aluminum material. The heat flows uninterrupted into an extensive array of 28 cooling fins that are an incredibly 0.080 inches thin for accelerated heat removal through the heatsink’s 709 square inches of overall surface area. The Mx heatsink has up to 579% more cooling fin surface area than prior generations of the DHCR Cooling Docks.



Heatsink Heat Removal
The cooling fins and cooling air channels run continuously from front-to-back with an upward angle to generate passive cooling air currents through the entire heatsink. Open space in front and under the heatsink supplies cool air for more effective silent passive cooling, as well as open space for fan driven active airflows. In order to increase the heatsink’s silent cooling capabilities, the finish is available with a new deep matte black anodize specially developed to improve surface emissivity and radiant cooling.



Heatsink Supports
The heatsink’s side support mounting points use 0.125 inch extra-thick pads to create an air gap between the heatsink and side supports. This air gap allows for open cooling airflow around the sides of the heatsink. The air gap and extra-thick pads work together to provide thermal separation between the heatsink, side supports, and exposure to hot exhaust airflows.