Mx Features: Compared

PERFORMANCE COMPARED

SVALT model approximate performance comparison, graphic rendering.

The Mx product line was designed to exceed all prior models with extreme cooling capabilities. The Mx's massive thermally conductive heatsink silently pulls heat from the laptop to help reduce laptop temperatures and quiet laptop built-in fans. The Mx’s optional fan cooling system helps tackle extra high-intensity and long-duration workloads.

See Testing Specs below to learn more.

DOCKS COMPARED

DHCR4 on left and MxD on right side and back views, rendering.

The MxD model pairs the Mx heatsink and dock side supports to take the 4th generation DHCR’s exceptional silent thermally conductive heatsink cooling to the next level.

• 202% increase in thermally conductive coupling area to silently extract more heat from the laptop processor location when compared to the DHCR 4th gen (219% increase over 1st, 2nd, 3rd gen).
• 365% increase in cooling fin surface area to silently remove more heat from the heatsink and to provide more cooling when compared to the DHCR 4th and 3rd gen (579% increase over 1st, 2nd gen).
• New cable management system hides cable clutter and holds cable in place for quick laptop setup.
• New adjustable height feet level uneven surfaces for rock solid laptop support.
• New modular laptop support system for multiple workstation setups with the massive heatsink.
• New modular and sustainable packaging system.

See Compare {link} page to learn more.

STANDS COMPARED

SxG12 side and back views, rendering.

MxS-hi w/ 140mm fan side and back views, rendering.

MxS-lo w/ 80mm fan side and back views, rendering.

The MxS-hi and MxS-lo models pair the Mx heatsink with stand supports to bring silent thermally conductive heatsink cooling to the Cooling Stand for the first time.

• Radicle increase in silent cooling capabilities for open-screen and closed-screen laptops.
• Option for even larger and quieter 140mm cooling fan.
• Improved adjustable height feet level uneven surfaces for rock solid laptop support.
• Improved modular laptop support system for multiple workstation setups with the massive heatsink.
• Improved modular and sustainable packaging system.

See Compare {link} page to learn more.