DHCR FEATURES


SVALT Cooling Dock model DHCR 4th generation with noted features diagram Overview of Key Features
Silent Heatsink Cooling
  • Silent thermally conductive heatsink cooling.
  • Specially engineered laptop coupling interface.
  • Massive heatsink carved from solid aluminum.
  • Extensive cooling fins transfer heat to surrounding air.
  • Passive airflow cooling through numerous air channels.
  • Cools laptop enclosure at processor location.

Active Airflow Cooling
  • Active airflow cooling with Fx Cooling Fan accessory.
  • Fx internally cools laptop processors thru center intake vent.
  • Separate Fx fan design moves more air with less noise.
  • Separate Fx fan design allows for max heatsink capacity.

Laptop Compatibility
  • Straight side rectilinear style to match latest MacBook Pros and Airs.
  • Optimized for heatsink cooling with latest MacBook Pros and Airs.
  • Optimized for internal cooling with 2021+ MacBook Pro.
  • Works with all Mac laptops of last decade, and most metal PC laptops.
  • Clamshell setup with laptop safely held in padded cradle.
  • Edge protection padding around conductive interface.
  • Replaceable user installed laptop retention pad.

Quality and Sustainability
  • Modular right-to-repair bolt/snap cooling systems.
  • Made locally in Portland, Oregon with focus on sustainability.
  • Innovative design with issued and/or pending patents.



SVALT Cooling Dock DHCR 4th gen performance test graph results with 2021 16-inch MacBook Pro (M1 Max/Pro) temperature reduction Performance Tested Features
The 4th gen’s thermally conductive heatsink silently reduces overall laptop temperatures, while the Fx Cooling Fan boosts peak performance potential for sustained heavy workloads. See the Performance page for details.



SVALT Cooling Dock model DHCR 4th generation with new and updated noted cooling features New 4th Gen Cooling Features
The new 4th generation DHCR includes extensive improvements for a substantial increase in cooling efficiency with the latest Apple MacBook Pro and MacBook Air laptops, along with comprehensive optimization for the 2021+ MacBook Pro. The new and improved 4th gen DHCR cooling features are grouped into the following three categories as shown in the diagram above and described below: (1) conductive cooling, (2) heatsink cooling and (3) airflow cooling.

  • (1) Improved conductive cooling with increased heat transfer from flat-backed laptops like the 2021+ MacBook Pro and 2022+ MacBook Air. This is accomplished with a 6% larger thermally conductive interface for increased surface area, up to 68% thinner laptop coupling plate for increased heat distribution, and available for the first time with the 4th gen, direct metal-to-metal laptop coupling for reduced impedance and unrestricted conductive heat transfer.

  • (2) Improved heatsink cooling with increased heat transfer from heatsink to passive/active cooling airflows. This is accomplished with up to 185% deeper and 18% taller cooling fin air channels, up to 52% increased surface area, and up to 846% more continuous and interconnected cooling fin air channels for increased heat flow throughout the heatsink.

  • (3) Improved airflow cooling with increased airflow into the 2021+ MacBook Pro’s center air intake vent for direct internal processor cooling, as well as flushing out more hot air away from laptop exhaust vents. This is accomplished with 7x more through-hole openings, a 91% increase in total through-hole open area, and 151% increase in opening width. A 22% smaller front horizontal air channel with 80% deeper curving sides concentrates cooling airflow along the laptop’s bottom edge vents.

    Available for the first time with the 4th gen, through-holes extend below the laptop’s bottom edge with a position and angle to guide cooling airflow into the 2021+ MacBook Pro’s center air intake.

    Also available for the first time are three new heatsink performance pads that help to manage airflows for improved cooling performance. New performance bottom pads feature 1/8” thickness to create a large underside open air channel for improved heatsink cooling. New performance laptop support pad features 1/8” thickness with a center cutout matching the heatsink’s through-holes for improved cooling airflow into a 2021+ MacBook Pro’s central air intake vent, and features side extensions into the horizontal channel’s curving ends. Both of the new 1/8” thick performance pads are designed to work in conjunction with the new performance insulating side pads that protect the heatsink from a 2021+ MacBook Pro’s hot air exhaust vents.

SVALT Cooling Dock model DHCR 4th generation with vertical section diagram
SVALT Cooling Dock model DHCR 4th generation with horizontal section diagram
Comparing 4th to 1st Generations
The above section cuts show the DHCR’s generational changes. See the Compare page for a detailed list of generational changes.



SVALT Cooling Dock model DHCR 4th generation Fx Cooling Fan diagram Active Airflow Cooling Features
The Fx Cooling Fan accessory adds a boost of active airflow cooling to heatsink Cooling Dock DHCR, DHC and DH models. Compared to a built-in fan design, the separate Fx Cooling Fan design allows for more efficient airflow through the fan as well as through the heatsink, which results in moving more cooling air with less noise. The separate fan design also allows the heatsink to be as large as possible with the maximum thermal mass and cooling surface area for improved heatsink cooling performance.

The Fx accelerates DHCR cooling through the following methods:
  • Cooling the heatsink by driving airflow through cooling fin air channels.
  • Flushing out hot air from the laptop’s exhaust vents by driving airflow through numerous through-holes and then the front horizontal air channel.
  • Internally cooling laptop processors by driving air into a compatible laptop’s center intake vent, such as with the 2021+ MacBook Pro, 2012-2015 MacBook Pro (Intel Retina) and 2010-2017 MacBook Air (Intel non-Retina).

The 4th generation DHCR includes the following revisions to improve active airflow cooling with the Fx:
  • Increased heatsink surface area for improved heat transfer from heatsink to active cooling airflows.
  • Increased through-hole open area for more direct internal processor cooling through the laptop’s center intake vent and for flushing out more hot air from the laptop’s exhaust vents.
  • Increased concentration of airflow along the bottom screen-hinge edge of laptop for more direct internal processor cooling and flushing out more hot air.
  • Increased guided airflow towards laptop intake vent for more direct internal processor cooling.
  • Three new heatsink performance pads that help to manage airflows for improved cooling performance with the Fx Cooling Fan.



SVALT Cooling Dock model DHCR 4th generation laptop compatibility diagram Laptop Compatibility Features
The DHCR has been specially designed, engineered and sculpted from solid aluminum to support and silently cool Apple's latest Apple Silicon laptop designs, such as the 2021+ MacBook Pro and 2022+ MacBook Air, while also working with all current and prior generation Apple laptops of the last decade.
  • Edge protection pads located around all four sides of the laptop coupling plate protect the laptop from edge and corner impacts during setup.
  • Leaning support for compatibility with a wide range of laptops, tablets and other devices.
  • Angled lower support shelf and non-slip padding for holding device in place.
  • Optional user installed laptop retention pad locks device in place for improved thermal coupling (extra pads included for future setups).
  • Universal support system design accommodates all current and prior Apple/Mac laptops of the last decade, as well as most PC laptops with metal enclosures (see specs for details).
  • Rectilinear styling with straight sides and anodized aluminum finish matches current 2021+ MacBook Pro and 2022+ MacBook Air designs.
  • Optimized dimensional fit and heatsink cooling design for 2021+ MacBook Pro and 2022+ MacBook Air, as well as optimized internal air cooling for 2021+ MacBook Pro.

The 4th generation DHCR includes the following revisions to improve optimization with the 2021+ MacBook Pro:
  • Larger thermally conductive laptop coupling plate increases contact with the 2021+ MacBook Pro flat-back design for more heat transfer.
  • The heatsink’s laptop coupling plate has rounded edges and corners to reduce scratching potential during setup with the direct metal-to-metal configuration.
  • More numerous through-holes spread over a wider area to match the 2021+ MacBook Pro center intake vent width for more direct internal processor cooling.
  • Smaller front horizontal air channel to concentrate cooling airflows along the 2021+ MacBook Pro bottom edge for more direct internal processor cooling and flushing out more hot air.
  • New air channels extend below the 2021+ MacBook Pro center intake vent for more direct internal processor cooling.
  • New performance bottom pads feature 1/8” thickness to create a large underside open air channel for improved heatsink cooling.
  • New performance laptop support pad features 1/8” thickness with a center cutout matching the heatsink’s through-holes for improved cooling airflow into the laptop’s cold air intake vent, and features side extensions into the horizontal channel’s curving ends.
  • Both of the new 1/8” thick performance pads are designed to work in conjunction with new performance insulating side pads that protect the heatsink from a 2021+ MacBook Pro’s hot air exhaust vents.
  • Up to a 227% increase in 2021+ MacBook Pro cooling surface area.



SVALT Cooling Dock model DHCR 4th generation clamshell mode diagram Laptop Clamshell Features
  • Leaning vertical closed-screen clamshell mode support for easy and secure clamshell mode setup with access to power, Touch ID and keyboard while safely held within padded cradle and connected to cables.
  • Disables laptop screen to optimize graphics for improved external display performance.
  • Reduces laptop screen, keyboard, trackpad and battery use for increased lifespan.
  • Uses external display, keyboard and trackpad / mouse for improved ergonomics.



SVALT Cooling Dock model DHCR 4th generation workstation diagram Laptop Workstation Features
  • Compact product footprint for more open desktop.
  • Heavy mass for increased stability.
  • Non-slip feet for stable workstation placement.
  • Two threaded underside holes for securing dock to media carts or for theft prevention.



SVALT Cooling Dock model DHCR 4th generation and Cooling Fan Fx modularity right-to-repair diagram Right-to-Repair Modularity Features
  • Fx Cooling Fan uses modular bolt/snap assembly for customer servicing, replacement, exchange or upgrade.
  • Fx Cooling Fan uses a bolt-on fan with standard 3/4-pin fan connection for customer servicing, replacement, exchange or upgrade with nearly any 80x80x25mm fan.
  • Fx Cooling Fan ships with all of the tools required for disassembly.
  • Packaging system works with all Cooling Dock models.


Material and Component Features
  • High-quality 6061 aluminum structure for extra strength and durability.
  • Anodized aluminum finish for durability and matching Mac laptop finishes.
  • Metal construction for long life span and end-of-life recyclability.
  • High-quality fans with long life performance (optional Fx).
  • High-quality components over-specced for increased performance and life.
  • Minimal use of plastic for reduced environmental impact.
  • Biodegradable package cushioning for reduced impact.


Company Features
  • Designed and crafted with care in and around Portland, OR, USA.
  • Design driven by a passion to make best-in-class products.
  • Innovative design with patents issued and/or pending.
  • Support for anyone with a SVALT product.


Additional Cooling Fan Features