COMPARE: Models-DHCR4-DHCR31

Compare DHCR 4th vs 3rd-1st Gen

The new 4th generation DHCR Cooling Dock includes extensive improvements for a substantial increase in cooling efficiency with the latest Apple MacBook Pro and Air laptops, along with comprehensive optimization for the 2021+ MacBook Pro. The 4th gen’s thermally conductive heatsink silently reduces overall laptop temperatures, while the Fx Cooling Fan boosts peak performance potential for sustained heavy workloads.

The new and improved 4th gen DHCR cooling features are grouped into the following three categories as shown in the diagram above and described below: (1) conductive cooling, (2) heatsink cooling and (3) airflow cooling.

(1) Conductive Cooling
The 4th gen DHCR improves conductive cooling with increased heat transfer from flat-backed laptops like the 2021+ MacBook Pro and 2022+ MacBook Air. This is accomplished with a larger thermally conductive interface for increased surface area, a thinner laptop coupling plate for increased heat distribution, and available for the time time with the 4th gen, direct metal-to-metal laptop coupling for reduced impedance and unrestricted conductive heat transfer.


(2) Heatsink Cooling
The 4th gen DHCR improves heatsink cooling with increased heat transfer from heatsink to passive/active cooling airflows. This is accomplished with deeper and taller cooling fin air channels, increased surface area, and more continuous and interconnected cooling fin air channels for increased heat flow throughout the heatsink.

(2a) Deeper and taller cooling fins and air channels increase surface area.


(2b) Continuous and interconnected cooling fins and air channels carved into a solid block of aluminum increase heat flow throughout the heatsink.


(3) Airflow Cooling
The 4th gen DHCR improves airflow cooling with increased airflow into the 2021+ MacBook Pro’s center air intake vent for direct internal processor cooling, as well as flushing out more hot air away from laptop exhaust vents. This is accomplished with more through-hole openings, an increase in total through-hole open area, and an increase in opening width. Available for the first time with the 4th gen, the through-holes become air channels that extend below the laptop’s bottom edge with a position and angle to guide cooling airflow into the 2021+ MacBook Pro’s center intake. A smaller front horizontal air channel with deeper curving sides concentrates cooling airflow along the laptop’s bottom edge vents.

(3a) More numerous through-hole open area spread over a wider area to increase cooling airflow.


(3b) Smaller front horizontal air channel with deeper curving sides to concentrate cooling airflow along the laptop’s bottom edge.


(3c)New numerous through-hole air channels that extend below the laptop’s bottom edge with a position and angle to guide cooling airflow into the 2021+ MacBook Pro’s center intake. This is an entirely new feature that was not included in prior generations.

(3d)Three new heatsink performance pads help to manage airflows for improved cooling performance. New performance bottom pads feature 1/8” thickness to create a large underside open air channel for improved heatsink cooling. New performance laptop support pad features 1/8” thickness with a center cutout matching the heatsink’s through-holes for improved cooling airflow into a 2021+ MacBook Pro’s central air intake vent, and features side extensions into the horizontal channel’s curving ends. Both of the new 1/8” thick performance pads are designed to work in conjunction with the new performance insulating side pads that protect the heatsink from a 2021+ MacBook Pro’s hot air exhaust vents.


The above section cuts show the DHCR’s generational changes.