COMPARE: Models-DHCR-DHCx
Compare DHCR vs DHCx
Design
- DHCR: The DHCR uses rectilinear styling with a solid heatsink carved with a smaller diameter end mill to create more air channels and more cooling fins within a given volume, which increases cooling surface area along with increasing costs. The DHCR’s new 4th generation design further elevates heatsink conductive cooling, heatsink passive airflow cooling and fan driven active airflow cooling. The DHCR has been designed to work with a separate Fx Cooling Fan. Separating the cooling fan from the heatsink avoids having to remove thermal mass and cooling surface area to make room for a built-in fan, which provides the DHCR heatsink with higher cooling capacity. The separated fan also allows the fan to be located within unrestricted open air for increased airflow and decreased noise.
- DHCx: The DHCx design is based on the 3rd generation DHC model with angular styling with a solid heatsink carved with a larger diameter end mill to create wider air channels, which increases cooling airflows. The DHCx model offers a single item configuration with a smaller product footprint and the convenience of a built-in fan for users that want active airflow cooling.
- DHCR: #1 overall performance ranking with optional Fx Cooling Fan.
- DHCx: #3 overall performance ranking compared to the DHCR with Fx Cooling Fan, and offers similar cooling to the DHCR when used without the Fx.
- DHCR: Optimized for the current generation of flat backed Apple laptops, such as the 2021+ MacBook Pro and 2022+ MacBook Air, but works with other current and prior gen Apple laptops, as well as many metal PC laptops. Optimization for the 2021+ MacBook Pro include features such as the following: Extra-large thermally conductive laptop coupling plate to extra more heat from the flat-backed laptop. The heatsink’s numerous vertical cooling fin air channels extending through the heatsink mass to become thru-holes that guide cooling airflow into a horizontal air channel with curving ends to flush out hot exhaust air from the laptop. The front horizontal channel uses a smaller size to concentrate airflow along the laptop’s bottom screen-hinge edge, while numerous thru-hole air channels extend below the laptop’s center intake vent, with the ends of the air channels angle up to guide cooling airflow into the laptop vent.
- DHCx: Optimized for more universal compatibility with current and prior gen Apple laptops, as well as many metal PC laptops.
- DHCR: 13.3 square inches of thermally conductive area for extracting more heat from flat backed laptops. Refined heatsink coupling plate allows for direct metal-to-metal laptop coupling with unrestricted heat transfer.
- DHCx: 8.9 square inches of thermally conductive area for fitting with laptops that have a more round or curving edge, as well as a wider variety of laptops.
- DHCR: 12 narrow cooing fins and 11 narrow vertical air channels for increased heat flow and cooling surface area, while providing high-volume of pass-through airflow.
- DHCx: 5 wide cooing fins and 4 wide vertical air channels for increased cooling airflow.
- DHCR: 143 square inches of cooling fin surface area for increased heat transfer to passive and active airflow. The cooling fin air channels extremely deep into the heatsink and extend all of the way through to become through holes along the front horizontal air channel.
- DHCx: 27 square inches of cooling fin surface area.
- DHCR: 2.6 pound heatsink carved from solid aluminum for increased thermal capacity and improved heat movement through thermal mass. The cooling fins run continuously from top-to-bottom and front-to-back for improved heat flow within the heatsink mass.
- DHCx: 2.0 pound heatsink carved from solid aluminum for improved heat movement through thermal mass.
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