DHCR SPECIFICATIONS

Cooling System Specs
  • The DHCR uses a thermally conductive coupling interface and large heatsink sculpted from solid aluminum to provide silent cooling. However, in addition to the silent cooling, the heatsink’s backside cooling fins, passthrough air hole, and frontside horizontal air channel are designed for active airflow cooling with the optional Cooling Fan Fx accessory that boosts heatsink cooling and internally cools processors on compatible laptops. The Fx can be purchased bundled with the DHCR, or can be purchased separately later. Note that the 2nd generation DHCR model includes curving cutouts in the through hole for improved active airflow cooling with the Fx.
  • Note: See Product Setup page for product setup, operation and additional user guide resources.
Device Compatibility Specs
  • Compatible Apple / Mac Laptops: The 2nd generation DHCR model is compatible for cooling and fit with Mac laptop models from the last decade, as well as other devices per the compatibility criteria listed below. The 2nd gen model is recommended for most laptops over the 1st gen model.
  • Compatible PC Laptops: Most standard to small PC laptops and other devices per the compatibility criterial listed below.
  • Compatibility Criteria for Types: Works with the following device and screen types: 1) Laptops operated in closed-screen clamshell mode while connected to an external display, keyboard/mouse and power supply. 2) Laptops with convertible/flip touchscreen, either while in a standalone configuration with touchscreen, or while also connected to a second display and/or keyboard/mouse. 3) Tablets with touchscreen, either standalone or connected to an additional display.
  • Compatibility Criteria for Fit: Works with devices that are up to approximately 1.100 inches thick, but will vary depending on the bottom edge shape of the device. An optional laptop retention pad can be installed to lock the laptop in place.
  • Compatibility Criteria for Cooling: Works with devices that do not have hot air exhaust vents located within the 4.800 inch center portion of the bottom edge (screen hinge edge on laptops), and that have a metal enclosure surface for coupling with the thermally conductive interface (note that customer installed surface coverings will not allow for thermal coupling and the transfer of heat from device to heatsink). Cooling performance improves with devices that have the following attributes, where more attributes result in more cooling: 1) Bottom/back metal enclosure surfaces that are flat at the location of the larger and taller thermally conductive pad to allow for continuous coupling and maximum heat transfer. 2) Processor location centered and near bottom edge to align the device’s highest temperature location with the most cooling for the largest heat transfer potential into the heatsink thermal mass. 3) Cool air intake vent locations centered on the bottom edge for direct internal cooling from the passthrough hole when used with the optional Cooling Fan Fx accessory.
  • Note: The new 2nd generation DHCR model includes curving cutouts in the front horizontal air channels for improved airflow and heatsink cooling with 2021-2022 MacBook Pros (M1 Pro/Max).
  • Note: See Laptops page to learn about Apple laptop’s built-in cooling systems and SVALT model recommendations.
Dimensional Specs
  • Product Side to Side: 4.8 inches.
  • Product Front to Back: 4.1 inches.
  • Product Top to Bottom: 4.1 inches.
  • Product Weight: 3.2 lbs.
  • Shipping Weight: 4.2 lbs.
Note: See Cooling Fan Fx product page for associated specifications.